Icb of Multifunctional Micromechanical Testing System for Shanghai Integrated Circuit... Tender

SHANGHAI INSTITUTE OF IC MATERIALS has floated a tender for Icb of Multifunctional Micromechanical Testing System for Shanghai Integrated Circuit Materials Research Institute Co., Ltd. The project location is China and the tender is closing on 27 Jun 2023. The tender notice number is 0705-234006077007, while the TOT Ref Number is 83599937. Bidders can have further information about the Tender and can request the complete Tender document by Registering on the site.

Expired Tender

Procurement Summary

Country : China

Summary : Icb of Multifunctional Micromechanical Testing System for Shanghai Integrated Circuit Materials Research Institute Co., Ltd

Deadline : 27 Jun 2023

Other Information

Notice Type : Tender

TOT Ref.No.: 83599937

Document Ref. No. : 0705-234006077007

Competition : ICB

Financier : Self Financed

Purchaser Ownership : Public

Tender Value : Refer Document

Purchaser's Detail

Purchaser : SHANGHAI INSTITUTE OF IC MATERIALS
10th Floor, Building 1, No. 333 Huangqing Road, Jiading District, Shanghai, Attn: Fan Jiaming, Lu Caihong, Tel: +86-18516300287、18116348618
China

Tender Details

Project Name: ICB of Multifunctional Micromechanical Testing System for Shanghai Integrated Circuit Materials Research Institute Co., Ltd

Tenders are invited for Multifunctional Micromechanical Testing System

Products List:
1: Multifunctional Micromechanical Testing System

Place of Implementation: Shanghai

Beginning of Selling Bidding Documents: 2023-05-29

Ending of Selling Bidding Documents: 2023-06-05

Price of Bidding Documents: ¥1000/$150

Deadline for Submitting Bids/Time of Bid Opening (Beijing Time): 2023-06-27 10:00

Documents

 Tender Notice