DELHI UNIVERSITY has floated a tender for Metallic Headers for Device Packaging. The project location is New Delhi, Delhi (NCT), India. The reference number is DU/DRDO/CONS/14 and it is closing on 18 Feb 2020.
Suppliers can request Register free of cost to get the complete Tender details and download the document.
Procurement Summary
State : Delhi (NCT)
Summary : Metallic Headers for Device Packaging
Deadline : 18 Feb 2020
Other Information
Notice Type : Tender
TOT Ref.No.: 40034403
Document Ref. No. : DU/DRDO/CONS/14
Competition : NCB
Financier : Self Financed
Purchaser Ownership : -
Document Fees : Refer Document
Tender Value : ₹ 35000
EMD : Refer Document
Purchaser's Detail
Purchaser : DELHI UNIVERSITY Address: University Campus
City: New Delhi
District: Delhi
State: Delhi (NCT)
Pin: 110021
Tel/Fax: 91-11-27667623 Country: India Email: registrar@du.ac.in Website: http://www.du.ac.in
Tender Details
Tenders are invited for Metallic Headers for Device Packaging
Work Description : Metallic Headers for Device Packaging
Tender Category : Goods
Tender Value in INR : 35, 000
EMD Amount in INR : 0.00
Tender Fee in INR : 0.00
Bid Submission End Date : 18-Feb-2020 05:00 PM
Product Category : Consumables (Hospital / Lab)