Procurement Summary
State : Telangana
Summary : Assembly and Bonding of Microwave Components
Deadline : 07 Oct 2019
Other Information
Notice Type : Tender
TOT Ref.No.: 36385814
Document Ref. No. : DLRL/20ATT009/CMS-II
Competition : NCB
Financier : Self Financed
Purchaser Ownership : -
Document Fees : Refer Document
Tender Value : ₹ 2360000
EMD : ₹ 47200
Purchaser's Detail
Purchaser : Defence Electronics Research Laboratory (DLRL)-DRDO, Hyderabad
Address: Chandrayangutta Lines
City: Hyderabad
District: Hyderabad
State: Telangana
Pin: 500005
Tel/Fax: 91-135 2787161, 2787128/24440061 24530264
Country: India
Email: director@dlrl.drdo.in
Website: https://www.drdo.gov.in/drdo/English/index.jsp?pg=homebody.jsp
Tender Details
Tenders are invited for Module Assembly Including Mmic Die Attachment and Wire Bonding for 80 Rf Circuits
Work Description : Module Assembly Including Mmic Die Attachment and Wire Bonding for 80 Rf Circuits
Tender Category : Goods
Tender Value in INR : NA
EMD Amount in INR : 47, 200
Tender Fee in INR : 0.00
Bid Submission End Date : 07-Oct-2019 11:00 AM
Product Category : Miscellaneous Goods
Documents
Tender Notice